View TB2924FG_398782.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

TB2924FG
TOSHIBA Bi-CMOS Digital Integrated Circuit Silicon Monolithic
TB2924FG
Class D, 20 W x 2-channel (BTL) Low-Frequency Power Amplifier IC
The TB2924FG is an audio output IC that employs the highly efficient class D method, developed for TV and home audio applications. The TB2924FG eliminates the need for heatsink(Note), thus allowing the design of an end product with a small footprint. It also incorporates a range of features, such as standby and muting, as well as different protective circuits.
Features
* Output: POUT = 13 W x 2ch (typ.) BTL VCC = 12 V, RL = 4 , THD = 10%, f = 1 kHz POUT = 7.5 W x 2ch (typ.) BTL VCC = 12 V, RL = 8 , THD = 10%, f = 1 kHz POUT = 19.5 W x 2ch (typ.) BTL VCC = 15 V, RL = 4 , THD = 10%, f = 1 kHz POUT = 21 W x 2ch (typ.) BTL VCC = 20 V, RL = 8 , THD = 10%, f = 1 kHz * * * * * * * * * * * High efficiency: When output is 10 W Distortion: 0.1% (1 W output, f = 1 kHz) Gain: 34dB (typ.) Small flat package: HSOP36-P-450-0.65 Muting/standby features Thermal AGC features Master and slave oscillation frequencies Oscillation frequency: fsw = 200 kHz (typ.) Operating supply voltage range: VCC (opr) = 11 V to 18V (Topr = 0C to 75C), (4 ) VCC (opr) = 11.4 V to 18 V (Topr = -20C to 75C) Operating supply voltage range: VCC (opr) = 11 V to 20V (Topr = 0C to 75C), (8 ) VCC (opr) = 11.4 V to 20 V (Topr = -20C to 75C) Protective circuits: thermal shutdown, short-circuit protection (load) = 88% (VCC = 15 V, RL = 8 ) Weight: 0.85 g (typ.)
These protection functions are intended to avoid some output short circuits or other abnormal conditions temporarily. These protect functions do not warrant to prevent the IC from being damaged. In case of the product would be operated with exceeded guaranteed operating ranges, these protection features may not operate and some output short circuits may result in the IC being damaged. The TB2924FG does not contain protection circuitry for shorts against VCC and ground. Extra care should be exercised when output pins serve as line output or adjacent pins are shorted together on the board. Note: Generally, the average power of the audio signal constitutes only one-fifth to one-tenth of the maximum output power, and in practice, will not exceed the permissible loss. However, care should be exercised so that it will not be really exceeded, considering the board's thermal resistance, ambient temperature, average output power and so forth. Toshiba has verified that the TB2924FG works properly without a heatsink on the Toshiba PC board for up to 10-watt by 2-channel output typical (VCC = 15 V, RL = 8 , THD = 10%, f = 1 kHz) with a sine-wave input. This product are sensitive to electrostatic discharge. When handling this product, protect the environment to avoid electrostatic discharge.(MM:200V OK,HBM:1500V OK) Install the product correctly. Otherwise, it may result in break down, damage and/or degradation to the product or equipment.
1
2006-01-25
TB2924FG
Pin Assignment and Block Diagram
Pre OSC FEEDFEED OSC OSC Pre GND2 SW IN2 2 (-) 2 (+) OUT IN VCC
NC
BOOT OUT PW OUT 2 (+) 2 (+) GND2 2 (-)
NC
NC
BOOT PW 2 (-) VCC2
NC
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
AGC
VCC/2 VCC/2 AGC AGC VCC/2
VCC/2
AGC
1
2
3
4
NC
5
6
7
8
9
10
11
12
13
14
15
16
17
18
VREG BOOT OUT 1 (+) 1 (+)
PW OUT GND1 1 (-)
NC BOOT PW 1 (-) VCC1
Pre Rip/F NC GND1
IN1 FEED FEED STBY MUTE VCC/2 1 (-) 1 (+)
*: Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purpose.
2
2006-01-25
TB2924FG
Pin Functions
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 Symbol VREG BOOT1 (+) OUT1 (+) NC PW GND1 OUT1 (-) NC BOOT1 (-) PW VCC1 Pre-GND1 Rip/F NC IN1 FEED1 (-) FEED1 (+) STBY MUTE VCC/2 NC Pre VCC OSC IN OSC OUT FEED2 (+) FEED2 (-) IN2 OSC SW Pre-GND2 PW VCC2 BOOT2 (-) NC NC OUT2 (-) PW GND2 OUT2 (+) BOOT2 (+) NC Reference supply voltage CH1 bootstrap pin (+) CH1 main amplifier output pin (+) No-connection pin (not connected inside the IC) GND for CH1 main amplifier output stage CH1 main amplifier output pin (-) No-connection pin (not connected inside the IC) CH1 bootstrap pin (-) Power supply pin for CH1 main amplifier output stage Signal GND Ripple filter pin No-connection pin (not connected inside the IC) CH1 main amplifier input pin CH1 main amplifier feedback pin (-) CH1 main amplifier feedback pin (+) Standby control pin Muting control pin Midpoint potential pin No-connection pin (not connected inside the IC) Signal power supply pin PWM oscillation frequency input pin PWM oscillation frequency output pin CH2 main amplifier feedback pin (+) CH2 main amplifier feedback pin (-) CH2 main amplifier input pin Oscillator on/off switch pin Signal GND Power supply pin for CH2 main amplifier output stage CH2 bootstrap pin (-) No-connection pin (not connected inside the IC) No-connection pin (not connected inside the IC) CH2 main amplifier output pin (-) GND for CH2 main amplifier output stage CH2 main amplifier output pin (+) CH2 bootstrap pin (+) No-connection pin (not connected inside the IC) Description
3
2006-01-25
TB2924FG
Supplementary Explanation (preliminary)

1. Pin 17 (muting switch)
* * * * Enable or disable audio muting. The input amplifier is switched to a dummy amplifier within the IC, so that the audio output is muted with the amplifier still operating (PWM switched operation with 50% duty ratio). Pin 17 outputs a voltage of approximately 2.4 V (approx. 4 VF) when open, while VTH for the built-in switch is lower than 1.8 V. Leaving the pin open, therefore, disables muting. Logic "H" or open: Demute "L" (GND): Mute on
2. Pin 16 (standby switch)
* * When the voltage on pin 16 becomes 1.8 V or higher, the bias circuit activates, enabling the IC to operate. Logic "H": IC active "L" (GND): IC standby on

3. Thermal AGC Function and Thermal Shutdown Circuit
* * If the chip temperature exceeds the junction temperature (150C min.), the thermal AGC function attenuates the input signal to maintain the chip temperature below the junction temperature. If the chip temperature further increases, the thermal shutdown circuit activates. The chip recovers from the thermal shutdown state once the chip temperature falls below the junction temperature.
4. Master and Slave Oscillation Frequencies (OSC IN, OSC OUT, OSC SW)
* When configuring a multichannel amplifier system with three or more channels, the oscillation frequency for a single IC can be used as a master and supplied to other ICs to prevent a beat due to a difference among switching frequencies.(Max.6ch (3ICs)) The oscillators for slave ICs should be turned off using the OSC SW pin. "H": Turn the oscillator on "L" (GND): Turn the oscillator off (Example with multiple ICs)
Pre VCC
*
VCC/2 470 pF Pre GND Open 26 22 OSC SW OSC OUT
26 22 OSC SW OSC OUT
21 OSC IN
21 OSC IN
Master IC
Slave IC
4
2006-01-25
TB2924FG
5. Reduction of Pop Noise Generated when Turning on and Off the Power Supply
* To reduce pop noise, it is recommended to enable muting by setting pin 17 (mute switch) to logic low before turning on or off the power supply or standby mode.
When turning on or off the standby mode (When the power supply is not turned on or off)
Mute Pin
Standby Pin
Turn on or off the standby mode after turning on muting.
When the power supply is off
Mute Pin
Standby Pin
Power Supply Pin
Turn off the power supply after turning on muting. Don't turn off the standby mode before turning off the power supply.
When the power supply is on
Mute Pin
Standby Pin
Turn on the power supply after turning on muting.
Timing charts may be simplified for explanatory purpose.
6. Board Mounting Consideration
The switching of the TB2924FG is controlled with a rectangular-wave signal of approximately 200 kHz (typical). It is recommended to place the TB2924FG far from the tuner portion, etc. that might be affected.
5
2006-01-25
TB2924FG
Maximum Ratings (Ta = 25C)
Characteristics Power supply Output current Power dissipation Operating temperature Storage temperature Symbol VCC Io(peak) PD Topr Tstg Rating 23 8 14.7 (Note) -20 to 75 -55 to 150 Unit V A W C C
Note: When the IC is used at 25C or higher with infinite heat sink, reduce 117.6 mW per 1C. The absolute maximum ratings of a semiconductor device are a set of specified parameter values, which must not be exceeded during operation, even for an instant. If any of these rating would be exceeded during operation, the device electrical characteristics may be irreparably altered and the reliability and lifetime of the device can no longer be guaranteed. Moreover, these operations with exceeded ratings may cause break down, damage and/or degradation to any other equipment. Applications using the device should be designed such that each maximum rating will never be exceeded in any operating conditions. Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in this documents.
6
2006-01-25
TB2924FG
Electrical Characteristics 1
Characteristics Quiescent supply current
(unless otherwise specified, VCC = 15 V, f = 1 kHz, Rg = 600 , RL = 8 , Ta = 25C)
Symbol ICCQ POUT (1) POUT (2) Output power POUT (3) POUT (4) (1) Efficiency Total harmonics distortion Voltage gain Channel Balance Input impedance Crosstalk Output noise voltage Switching frequency Standby supply current Power transistor ON resistance Mute attenuation level Control voltage for pin 17 muting switch Control voltage for pin 16 standby switch Control voltage for pin 26 oscillator on/off switch (2) THD GV CB RIN C.T. VNO fsw ISTB RDS-ON ATTMUTE VMUTE off VMUTE on VSTB off VSTB on VOSC on VOSC off Test Circuit 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Vin = 0 THD = 10% VCC = 18 V, THD = 10% RL = 4 , VCC = 12 V, THD = 10% RL = 4 , VCC = 15 V, THD = 10% POUT = 10 W POUT = 1.0 W POUT = 1 W VOUT = 0.775 Vrms VOUT = 0.775 Vrms Rg = 10 k, VOUT = 0.775 Vrms Rg = 10 k, B.W. = DIN AUDIO During standby 0dB = VOUT = 0.775 Vrms Not muted Muted Amplifier operating (not standby) Amplifier stopped (standby on) Oscillator operating Oscillator stopped Test Condition Min 9 12.5 11.5 18 80 63 32.5 -1.0 -56 160 -71 1.8 GND 1.8 GND 1.8 GND Typ. 55 10.5 15 13 19.5 88 66 0.1 34 0 30 -65 0.2 200 0.2 0.3 -78 Max 70 0.3 35.5 1.0 0.3 300 0.34 VCC 0.9 VCC 1.1 VCC 0.5 V % % dB dB k dB mVrms kHz mA dB V W Unit mA
V
7
2006-01-25
TB2924FG
Test Circuit Diagram 1
Test point
330 F C7 1 F C8 * LPF OUT2 (+) Out C Out L L1 C1 RL 8 Out C Out L L2 C2 GND 2200 F VCC
LPF *
OUT2 (-) 1 F C14 1 F C9 IN2
330 F C13
560 pF R1 C3 150
R2 560 pF 150 C4
OSC OFF
470 pF
C11
C5
0.1 F
C6
36
35
34
33
32
31
NC
30
29
28
Heat sink
27
26
25
24
23
22
21
C12
0.1 F
C10 1800 pF
1800 pF
20
19
NC
NC BOOT OUT PW OUT 2 (+) 2 (+) GND2 2 (-)
NC BOOT PW 2 (-) VCC2
Pre OSC IN2 FEED FEED OSC OSC Pre GND2 SW 2 (-) 2 (+) OUT IN VCC
BOOT OUT VREG 1 (+) 1 (+)
BOOT PW PW OUT1 NC 1 (-) VCC1 NC GND1 (-)
Pre GND1 Rip/F NC
IN1
FEED FEED 1 (-) 1 (+) STBY MUTEVCC/2
1
0.47 F
2
C16 C15
3
4
5
6
7
C21
8
9
Heat sink
10
11
12
13
14
1800 pF
15
16
17
18
C24 C26 1800 pF C27 4.7 F Standby ON 100 k 1 F R5 MUTE C28 ON C29 470 F /50 V
0.1 F Out L
560 pF R3 C17 150 L3 Out C C19
R4 560 pF 150 C18 Out C C20 RL 8 L4
0.1 F Out L
1 F OUT1 (-) 1 F C22 330 F C23
OUT1 (+)
IN1
* LPF
LPF * Test point
*: Output L (4 ): 10 H (A7502BY-180M: TOKO, INC.) *: Output C (4 ): 1.0 F *: Output L (8 ): 18 H (A7502BY-180M: TOKO, INC.) *: Output C (8 ): 0.47 F *: Components in the test circuits are only used to obtain and confirm the device characteristics. These components and circuits do not warrant to prevent the application equipment from malfunction or failure. *: In addition to the low-pass filters (chebyshev LPFs) shown above, a fourth low-pass filter with a cut-off frequency of 30 kHz is used for device characterization.
C25
8
2006-01-25
TB2924FG
Example Application Circuit
GND 1 F OUT2 (+) Out RL 8 1000 F OUT2 (-) Out 1 F 1 F IN2 VCC
OSC OFF
1800 pF
0.1 F
36
35
34
33
32
31
NC
30
29
28
Heat sink
27
26
25
24
23
22
470 pF
0.1 F
1800 pF
21
20
19
NC
NC BOOT OUT PW OUT 2 (+) 2 (+) GND2 2 (-)
NC BOOT PW 2 (-) VCC2
Pre OSC IN2 FEED FEED OSC OSC Pre GND2 SW 2 (-) 2 (+) OUT IN VCC
BOOT OUT VREG 1 (+) 1 (+)
PW OUT1 BOOT PW NC GND1 (-) NC 1 (-) VCC1
Pre GND1 Rip/F NC
IN1
FEED FEED 1 (-) 1 (+) STBY MUTEVCC/2
1
0.47 F
2
3
4
5
6
7
8
9
Heat sink
10
11
12
13
14
1800 pF
15
1800 pF
16
17
18
Standby ON 100 k MUTE 1 F
0.1 F Out
0.1 F Out
4.7 F
1 F
OUT1 (+)
RL 8
OUT1 (-) 1 F
IN1
*: Output L (4 ): 10 H (A7502BY-180M: TOKO, INC.) *: Output C (4 ): 1.0 F *: Output L (8 ): 18 H (A7502BY-180M: TOKO, INC.) *: Output C (8 ): 0.47 F *: The application circuits shown in this document are provided for reference purposes only. Especially, thorough evaluation is required on the phase of mass production design. Toshiba dose not grant the use of any industrial property rights with these examples of application circuits. *: When no signal is present, the power supply current varies with the characteristics of the output inductance (Out L). *: For all capacitors that are not indicated by the electrolytic capacitor symbol, use ceramic capacitors with an appropriate withstand voltage.
9
2006-01-25
ON
220 F
TB2924FG
Toshiba's PC Board Layout (Mounting side)
(Back side)
10
2006-01-25
TB2924FG
DATAs for reference (Typ.)
THD - POUT_f
50 VCC = 15 V 30 RL = 8 100: to 30 k 10 1 k: 400 to 30 k 5 10k: 400 to 3 30 kHz LPF
THD - POUT_VCC
50 30 f = 1 kHz RL = 8 10 1 k: 400 to 30 k 5 3 30 kHz LPF
OUT2_10 k
THD (%)
1 0.5 0.3
OUT1_10 k
THD (%)
1 0.5 0.3 0.1 0.05 0.03 OUT2_15 V OUT2_12 V OUT1_12 V OUT1_15 V
OUT1_1 k 0.1 0.05 0.03 OUT1_100 0.01 0.01 0.03 0.1
OUT2_1 k
OUT2_100 0.3 1 3 10 30 100 0.01 0.01 0.03 0.1
0.3
1
3
10
30
100
POUT
(W)
POUT
(W)
THD -f
50 30 VCC = 15 V RL = 8 10 POUT = 1 W Filtr: to 30 k (f = 20~800) 5 400 to 30 k (f = 1 k to 2 k) 3 400 to 80 k (f = 4 k to 6 k) 400 to (f = 8 k to 40 k) 1 0.5 0.3 0.1 0.05 0.03 0.01 10 5 OUT1 0 0 OUT2 25 f = 1 kHz RL = 8 THD = 10% Analyzer filter: 400 Hz to 30 kHz Output: 30 k LPF
POUT_VCC
20
OUT1
(W) POUT
THD (%)
15
OUT2 10
100
1000
10000
100000
5
10
15
20
f
(Hz)
VCC
(V)
- POUT
100 5 VCC = 15 V f = 1 kHz RL = 8
PD - POUT
80
4
()
40
PD
VCC = 15 V f = 1 kHz RL = 8 2 4 6 8 10 12 14 16
(W)
60
3
2
20
1
0 0
0 0
2
4
6
8
10
12
POUT
(W)
POUT
(W)
11
2006-01-25
TB2924FG
GV - f
40 OUT1 35 30 OUT2 120 100 140 RL = 8 VIN = 0 V L = 18 H
ICCQ - VCC
(dB)
(mA) ICCQ
VCC = 15 V RL = 8 VOUT = 0.775 Vrms Output: 30 k LPF 100 1000 10000 100000
25 20 15 10 5 0 10
80
GV
60
40 20
0 0
5
10
15
20
25
30
f
(Hz)
VCC
(V)
ISTBY - VSTB
60 VCC = 15 V 50 RL = 8 VIN = 0 V 0 20 f=1k RL = 8 VOUT = 1Vrms VCC = 15 V
ATTMUTE - VMUTE
(mA)
ATTMUTE
0.5 1.0 1.5 2.0 2.5 3.0 3.5
(dB)
40
-20
30
-40
ISTB
20
-60
10
-80
0 0
-100 0
0.5
1.0
1.5
2.0
VSTB (V)
VMUTE
(V)
C.T. - f
0 VCC = 15 V RL = 8 Rg = 10 k VOUT = 0.775 Vrms f=1k RL = 8 -10 Vrip = 0.775 Vrms VCC = 15 V -20 -30 -40 -50 -60 OUT2 OUT1 -70 -80 10 0
C.T. - Rg
-20
(dB)
-40
C.T.
OUT1 OUT2 -60
C.T.
(dB)
OUT2 OUT1 OUT1 OUT2
-80 10
100
1000
10000
100000
100
1000
10000
f
(Hz)
Rg
()
12
2006-01-25
TB2924FG
VNO - VCC
0.5 RL = 8 Rg = 10 k VIN = 0 V Filt: DIN_AUDIO 1 RL = 8 VCC = 15 V 0.8
VNO - Rg
0.4
(mVrms)
0.3 OUT1 0.2 OUT2 0.1
(mVrms) VNO
0.6
VNO
0.4 OUT1 0.2 OUT2
0 0
5
10
15
20
0 10
100
1000
10000
VCC
(V)
Rg
()
R.R. - f ripp
Rg = 620 RL = 8 -10 Vrip = 0.775 Vrms VCC = 15 V -20 0 0 Rg = 620 RL = 8 Vrip = 0.775 Vrms VCC = 15 V -20
R.R. - Rg
-10
Ripple Rejection R.R. (dB)
-30
Ripple Rejection R.R. (dB)
-30
-40
OUT2
-40 OUT2 -50 OUT1
-50
OUT1
-60 10
100
1000
10000
-60 10
100
1000
10000
100000
f ripp
(Hz)
Rg
()
PD - Ta
16
(W)
14 (1) Infinite heat sink 12 10 8 6 4 2 0 0 (2) No heat sink (when mounted on Toshiba's PC Board)
Allowable power dissipation PD
25
50
75
100
125
150
Ambient temperature
Ta (C)
13
2006-01-25
TB2924FG
Package Dimensions
Weight: 0.85 g (typ.)
14
2006-01-25
TB2924FG
Strong Electrical and Magnetic Fields
Devices exposed to strong magnetic fields can undergo a polarization phenomenon in their plastic material, or within the chip, which gives rise to abnormal symptoms such as impedance changes or increased leakage current. Failures have been reported in LSIs mounted near malfunctioning deflection yokes in TV sets. In such cases the device's installation location must be changed or the device must be shielded against the electrical or magnetic field. Shielding against magnetism is especially necessary for devices used in an alternating magnetic field because of the electromotive forces generated in this type of environment.
15
2006-01-25
TB2924FG
16
2006-01-25

▲Up To Search▲

Price & Availability of TB2924FG

	To Download TB2924FG Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .